FX-940 AOI

PRODUCT DESCRIPTION

Multi-function system with top-down viewing, Capture on the fly technology
FEATURES
  • • Proprietary megapixel color imaging
  • • Capture on the fly technology
  • • 1 top-down and 4 side angle cameras
  • • Quick set-up
  • • High speed
  • • High defect coverage / low false failure
  • • Optional 3D inspection
SPECIFICATIONS
Throughput Up to 30 sq. in./sec. > 1.5 million components per hour
Maximum Board Size 20” x 21” (500mm x 525mm)
Clearance 2” (50mm) top and bottom
Minimum Component Size0201; 01005 with high magnification option
False Calls<500 PPM (<0.05% typical)
Defects DetectedPart: position, missing, wrong, polarity, skew, tombstone
Lead: bent, lifted, bridging
Solder: open, insufficient, short, solder balls
Power Supply 110-220VAC, 50/60 Hz, 15 amps
Air supply source 60 PSI min., 1/4” air hose, 2 CFM
System footprint 39” x 52” x 60” (1000mm x 1329mm x 1531mm)
Weight 950 lbs (430 kg)
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