M1m AOI

PRODUCT DESCRIPTION

Multi-function system with top-down viewing, 3 megapixel camera
FEATURES
  • • Megapixel color imaging
  • • High magnification 
  • • top-down viewing camera
  • • Quick set-up
  • • High speed
  • • High defect coverage
  • • Low false failure rate
SPECIFICATIONS
Throughput 75-125 sq. mm / sec.
Maximum Inspection Area 350mm x 250mm x 25mm XYZ (14 x 10 x 1 in.)
Device Types JEDEC, MCMs, Hybrids, FlipChip, BGA, microBGA,MEMs, waffle packs
Defects DetectedWires: missing, damaged, no stick, off pad, club foot, lifted
Die: missing, wrong, polarity, chipped, cracked, contamination
Part: position, missing, wrong, polarity, skew, tombstone
Epoxy: contamination, insufficient, excessive, bridging
Solder: contamination, insufficient, excessive, bridging
Power Supply 100-240 VAC, 50/60 Hz, 10 amps
Air supply source 60 to 90 PSI (0.4 to 0.6 Mpa), 2 CFM
System footprint 876mm x 1010mm x 1400mm (34.5 x 40 x 55 in.)
Weight 770 kg (1700 lbs)
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