Because heating and cooling are done while the pressure is being applied, lifting up can be prevented, and therefore, most suitable for thermo-compression bonding of flexible circuits or wires, soldering or heat fusing of plastic objects.
It is superior in reproducibility of temperature and time, and as a result, variation of production quality by the operator can be minimized.
Because of local and instantaneous heating, thermal effect to the peripheral areas can be restrained. It is Pb free compliant.