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    Our new generation patented drop-jet design fluxer offers quick and effective flushing of the pressurised flux chamber. This helps to keep maintenance levels to a minimum whilst enabling use of higher solids content fluxes as well as water soluble fluxes.

    As part of the entry level philosophy for this system, a newly designed low maintenance solder bath and pump mechanism has been developed which moves in three axes of movement whilst not limiting access to the PCB. Solder is applied using proven technology through our AP-1 nozzle design or custom specialised nozzles, incorporating patented spiral solder return to bath technology offering reduced solder balling potential.

    As with more sophisticated Pillarhouse systems, the soldering process is enhanced by an inerted hot Nitrogen curtain which provides an inert atmosphere for the soldering process and also assists in the prevention of oxidation. This process provides a local pre-heat to the joint thus reducing thermal shock to localised components.

    The Jade-Handex is controlled by a PC, through PillarCOMM, a Windows® based “Point & Click” interface with PCB image display, as illustrated below. Additionally, our PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.

  • Integral PC and machine mounted TFT monitor
  • Motorised auto solder top up & level detect
  • Inerted Nitrogen system
  • Titanium Drop-jet fluxer
  • Rotary indexing table with twin work holding positions
  • Set of AP-1 solder nozzle tips
  • Internal fume extraction
  • Colour programming camera
  • Process viewing camera with record feature
  • Manual fiducial correction system
  • Multiple level password protection
  • Flux level sensor
  • Solder wave height measurement and correction system
  • Thermal nozzle calibration system using integrated setting camera
  • Auto-nozzle conditioning system
  • Pump rpm monitoring
  • PillarCOMM windows software
  • PillarPAD offline programming system
  • Lead free capability
  • Day-to-day service kit
1627mm (64”) – (excluding light tower)
1900mm (74“)
2508mm (99”)
Maximum Board size
457mm x 508mm (18” x 20”)
Edge Clearance
Above / below 3mm
Height Clearance
Above 95mm / below 45mm nominal
All commonly used solder types (including Lead Free)
Solder pot capacity
15kg (33lb) – standard 25kg (55lb) – large bath
AP-1 style (2.5, 3, 4, 6, 8, 10, 12mm) Extended and Jet-Tips (up to 25mm dia) Jet-Wave (up to 25mm width) 150mm Wide Wave nozzle
Low maintenance drop-Jet system. Low solids, no clean flux, pressurised and inerted system, optional water soluble system available
X, Y & Z Axis Resolution
+/- 0.05mm
Nitrogen usage
30-100 litres/min. – solder nozzle configuration dependent
Nitrogen Purity
99.995% or better
Power Supplies
Single phase + PE
230 V
10.5kVA max. – Machine configuration dependent.