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YSB55w
PRODUCT DESCRIPTION
- High bonding accuracy and x3 productivity of conventional machines!
This brings a New Era in Semiconductor packaging for the expanding flip chip market. - High-Speed 8-die simultaneous pickup & simultaneous transfer achieve 13,000 UPH
- High-Accuracy ±5μm (3σ)
- High-Quality & Flexibility
features
- High-Speed. 8-die simultaneous pickup & simultaneous transfer achieve 13,000 UPH
- Multi-die supply
- Wafer feed unit
- High rigidity frame & beam
specifications
Applicable substrate
L240 x W200 to L50 x W50mm
Substrate thickness
0.2 to 3.0mm
Transport direction
Left to Right (option : Right to Left)
Bonding accuracy
±5µm (3σ) (When using Yamaha's standard components)
Throughput
13,000UPH (Including processing time)
Applicable wafer size
12 inch wafer
Applicable die size
□2 to 30mm
Power supply
3-Phase AC 200/208/220/240/380/400/416V ±10% 50/60Hz
Air supply
0.45MPa or more
External dimension
L2,090 x D1,866 x H1,550mm (YSB55w main unit & wafer feed unit)
Weight
Approx. 3,600kg (YSB55w main unit & wafer feed unit)
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