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S125-ald / S230
PRODUCT DESCRIPTION
A machine automatically splitting ceramic substrate. With an accuracy of ±30 μm, up to 230 x 230 mm in size can be supported.
features
- Max. work sheet size : S125-ald : X125mm x Y125mm / S230 : X230mm x Y230mm
- Processing speed :500mm/s (100mm/s recommended)
- Processing accuracy: ±30μm
specifications
Model
S125-ald / S230
Type
S125-ald-2/S230
Application examples
Sintered ceramic substrate
Machining target-Max. work sheet size
X125mm x Y125mm / X230mm x Y230mm
Machining target-Work sheet thickness
0.3～1.0mm
Machining target-Work sheet suction face
Entire bottom face
Processing capability-Accuracy *1
±30μm
Processing capability-Speed *1
500mm/s (100mm/s recommended)
Cutter-Type
Rotary diamond cutter
Cutter-Outline size
φ3.2 x 0.65(W)mm
Cutter-Tip angle
130°
Cutter-Pushing force
0.5～5kgf
Work sheet transfer-Loading / Unloading
Automatic/Manual
Image processing -Camera view
X4.8 x Y3.6mm (standard)
Image processing -Pattern detection
Pattern recognition via grayscale
Image processing -Illumination type
Transmission light, reflection light
Hardware-Interface
LAN,USB
Hardware-Display
17 inch LCD with touch panel
Software-OS
Windows7
Software-Production support function
pressure measurement (load cell)
Usage environment-Weight
Approx. 1,200kg /Approx. 1,000kg
Usage environment-Power supply
1-phase, 180 to 240V AC, 50/60Hz, 3kVA
Usage environment-Dry air 0.5MPa
0.5MPa
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