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S20
PRODUCT DESCRIPTION
- Enhancement to 3D MID
- Large board handling capability
- Wide ranging component handling capability and high feeder capacity
- Ultimate flexibility and fast & easy setup
features
- Realize a hybrid process of mount and dispensing
- New head unit for higher speed placement
- Long board handling capability
- Max. feeder capacity 180 lanes
specifications
Board size(with buffer unused)
Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455)
Board size(with input or output buffer used)
-
Board size(with input and output buffers used)
Min. L50 x W30mm to Max. L540 x W510mm
Board thickness
0.4 - 4.8mm
Board flow direction
Left to right (Std)
Board transfer speed
Max 900mm/sec
Placement speed (12 heads + 2 theta) Opt. Cond.
0.08sec/CHIP (45,000CPH)
Placement accuracy A (μ+3σ)
CHIP +/-0.040mm
Placement accuracy B (μ+3σ)
IC +/-0.025mm
Placement angle
+/-180 degrees
Z axis control / Theta axis control
AC servo motor
Component height
Max 30mm*1 (Pre-placed components: max 25mm)
Applicable components
0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -)
Component package
8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray
Drawback check
Vacuum check and vision check
Screen language
English, Chinese, Korean, Japanese
Board positioning
Board grip unit, front reference, auto conveyor width adjustment
Component types
Max 180 types (8mm tape), 45 lanes x 4
Transfer height
900 +/- 20mm
Machine dimensions, weight
L1750xD1750xH1420mm, Approx. 1,500kg
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