Trans Technology – SMT Electronics Solutions Singapore

JADE PRO

PRODUCT DESCRIPTION

The Jade PRO is a hand load system, incorporating a universally adjustable tooling carrier capable of accommodating PCBs or pallets up to 457x508mm.
The Jade PRO is configured with twin adjacent solder baths on independent Z axis drives. This achieves increased production flexibility by permitting use of two different nozzle tip sizes which can be allocated as process requirements dictate within any particular area on a PCB..

The Jade PRO series is controlled by a PC, through PillarCOMM, a Windows^® based ‘Point & Click’ interface with a PCB image display.

Additionally our PillarPAD offline programming package allows the operator to produce programs independently from the machine using Gerber data.

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features

DC servo drives
Integral PC and machine mounted monitor
Twin solder bath capability on independent Z axis
Inerted Nitrogen system
Internal fume extraction
Titanium Drop-Jet fluxer
Universally adjustable tooling carrier
Auto motorised wire solder feed & level detect
Solder bath coding – identifies correct bath for program
Solder wave height measurement and correction
Set of AP style solder nozzle tips
Thermal nozzle calibration system using integrated setting camera
Auto-nozzle conditioning system
Manual fiducial correction system
Colour programming camera
Process viewing camera(s)
Multilevel password protection
Light stack
PillarCOMM Windows® based ‘Point & Click’ interface
PillarPAD offline programming system
Lead-free compatible
Day-to-day service kit

specifications

Height

1230mm / 48” to 2025mm / 80″- with light stack

Width

1250mm / 49“ to 1700mm / 67”- with side auto changer

Depth

1495mm / 59” 1720mm / 68” with flux bottles

Board size

457mm x 508mm / 18”x 20”

Edge clearance:

Above / below 3mm

Height clearance

Above / below 40mm nominal 90mm max. top-side only

Solder

Most commonly used solder types – including lead-free

Solder pot capacity

20kg standard – 30kg large bath

Applicators

AP style – 2.5mm to 16mm dia. Extended AP style – 2.5mm to 20mm dia. Micro nozzle – 1.5mm to 2.5mm Jet-Tip style – 6mm to 40mm dia. Jet-Wave style – up to 25mm width Special dedicated nozzles available upon request

Flux

Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available

X, Y & Z Axis resolution

0.1mm

Repeatability

+/- 0.05mm

Nitrogen usage

Up to 40 litres gas/min per bath with standard AP solder nozzle, 5 bar pressure. Refer to Pillarhouse for Nitrogen usage requirement with dedicated multi-tube nozzle assemblies.

Nitrogen purity

99.995% or better

Air supply pressure

5 bar / 72 psi

ower supplies

Three-phase + neutral + PE

Voltage

230V phase to neutral / 400V phase to phase

Frequency

50/60Hz

Power

Maximum 9kVA per phase machine configuration dependent