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    Supplied as standard with our patented design Drop-Jet fluxer, this system offers accurate, controlled flux deposition either prior to or during the optional top side preheat function. Preheat can be controlled via an optional top-side closed loop pyrometer system for optimum temperature profile regulation.

    Our low maintenance solder bath and pump mechanism moves in three axes. Solder is applied using our proven technology single point AP nozzle design incorporating patented spiral solder return to bath technology offering increased wave stability with reduced potential for solder balls.

    The system can also accommodate our latest generation micro nozzle, together with Jet-Wave, Wide-Wave and dedicated multi-tube single dip solder technology.

    As with all Pillarhouse systems, the soldering process is enhanced by a hot Nitrogen curtain which provides an inert atmosphere for the soldering process and also assists in the prevention of oxidation. This process provides a local preheat to the joint thus reducing thermal shock to localised components.

    The Synchrodex is controlled by a PC, through PillarCOMM, a Windows® based ‘Point & Click’ interface with PCB image display. Additionally, our PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.

  • In-line motor driven auto width adjust through feed synchronous movement conveyor
  • Conveyor side clamping
  • Integral PC and machine mounted monitor
  • Motorised auto-solder top-up (wire feed) & solder level detect
  • Heated inerted Nitrogen system
  • Titanium Drop-Jet fluxer
  • Set of AP solder nozzle tips
  • Internal fume extraction
  • Colour programming camera
  • Solder wave height measurement and correction
  • Pump rpm
  • Auto-nozzle conditioning system
  • Thermal nozzle calibration system using integrated setting camera
  • Windows® based PillarCOMM ‘Point & Click’ interface
  • Light stack
  • Auto fiducial recognition and correction system
  • Flux level sensor
  • Multiple level password protection
  • PillarPAD offline programming system
  • SMEMA compatible
  • Process viewing camera with record feature
  • Lead-free capability
  • Day-to-day service kit
1615mm / 63” – excluding light stack
813mm / 32“
2024mm / 80”
Board size
Max. – 457mm x 610mm / 18”x 24” Min. – 102mm x 102mm / 4”x 4”
Edge clearance
Above/below 3mm
Height clearance
Below 40mm – above 45mm 100mm – upon request
Fan: 276mm dia.
1000m3/hr / 589 CFM
Most commonly used solder types – including lead-free
Solder pot capacity
15kg standard – 25kg large bath
AP style – 2.5 – 16mm dia. Extended and Jet-Tip nozzles – up to 25mm dia. Jet-Wave nozzles – up to 25mm width 150mm Wave nozzle
Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
Flux tank capacity
1 litre
Fluxer speed
50 dots/second
Deposition size
4.0-6.0mm / 0.16-0.24”
X, Y & Z axis resolution
+/- 0.05mm
Nitrogen supply pressure
5 bar / 72 psi
Nitrogen usage
30-100 litres/min. – solder nozzle configuration dependent
Nitrogen purity
99.995% or better
Air supply pressure
5 bar / 72 psi
Air usage
10 litres/min. / 0.35 CFM
Power Supplies
Single phase + PE
10.5kVA max. – machine configuration dependent
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