Trans Technology – SMT Electronics Solutions Singapore

JADE MK II

PRODUCT DESCRIPTION

As part of the entry-level philosophy for this system, a low maintenance solder bath and pump mechanism has been developed which moves in three axes of movement whilst not limiting access to the PCB. Solder is applied using proven technology through our AP nozzle design or custom specialised nozzles, incorporating patented spiral solder return to bath technology offering reduced solder balling potential.

As with all Pillarhouse systems, the soldering process is enhanced by a hot Nitrogen curtain which provides an inert atmosphere. This method of soldering also assists in the prevention of oxidisation and provides a local preheat to the joint, thus reducing thermal shock to localised components.

The Jade MKII is controlled by a PC, through PillarCOMM, a Windows^® based ‘Point & Click’ interface with PCB image display.
Additionally, our PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.

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features

Integral PC and machine mounted TFT monitor
Inerted Nitrogen system
Titanium Drop-Jet fluxer
Set of AP style solder nozzle tips
Universally adjustable tooling carrier
Internal fume extraction
Colour programming camera
Process viewing camera
Solder wave height measurement and correction
Auto solder top-up (wire feed) & solder level detect
Thermal nozzle calibration system using integrated setting camera (requires manual correction)
PillarCOMM Windows® based ‘Point & Click’ interface
PillarPAD offline programming package
Multiple level password protection
Manual fiducial correction
Lead-free compatible
Day-to-day service kit

specifications

Height

1403mm / 55” – excluding light stack

Width

1000mm / 40“

Depth

1351mm / 53”

Board size

457mm x 508mm / 18”x 20” (larger PCB size available upon request)

Edge clearance

Above / below 3mm

Height clearance

Above / below 40mm nominal Above 190mm – special application

Solder

Most commonly used solder types – including lead-free

Solder pot capacity

8kg

Applicators

AP style – 2.5mm to 16mm dia. Extended AP style – 2.5mm to 20mm dia. Micro nozzle – 1.5mm to 2.5mm Jet-Tip style – 6mm to 20mm dia. Jet-Wave nozzle – up to 25mm width Special dedicated nozzles available upon request

Flux

Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water soluble system available

X, Y & Z Axis resolution

0.1mm

Repeatability

+/- 0.05mm

Nitrogen usage

35 litres gas/min. 5 bar pressure

Nitrogen purity

99.995% or better

Air supply pressure

5 bar / 72 psi