Filter by
ORISSA FUSION
PRODUCT DESCRIPTION

    The Orissa Fusion is available in two frame sizes.

    Fusion Compact

    The standard three station cell can be configured to handle PCB’s up to 381mm x 430mm (fluxer, pre-heat and solder).   Alternatively, this system can be supplied as a two station unit each with increased PCB handling capacity up to 746mm x 430mm.

    Fusion Standard

    The standard four station cell can be configured to handle PCB’s up to 430mm x 381mm (fluxer, pre-heat, solder, solder).  For high speed applications this same unit can be configured as fluxer/pre-heat and up to three solder modules with as many as five heater options. Maximum PCB handling size in Y Axis of up to 500mm with limited auto-fiducial and PCB warp correction function up to 430mm.

    Each solder cell can be configured with any of the currently available Pillarhouse solder technologies: custom-dip, multi-dip, Jet-Wave and single point AP down to the patented 1.5mm micro nozzle.

    Easy, rapid non-contact solder pot changeover is facilitated via the optional heated pot exchange trolley.

features
  • Integral PC and machine mounted Titanium monitor
  • In-line motor driven width adjust through feed conveyor
  • Conveyor side clamping
  • DC servo drives with encoders on X, Y & Z axis
  • Inerted Nitrogen system
  • Internal fume extraction
  • Titanium Drop-Jet fluxer
  • Motorised wire feed auto solder top-up & solder level detect
  • Solder wave height measurement and correction system
  • Solder bath coding – identifies correct bath for program
  • Thermal nozzle calibration system using integrated setting camera
  • Auto-nozzle conditioning system
  • Pump rpm
  • Set of AP solder nozzle tips
  • Colour programming camera
  • Process viewing camera
  • Automatic fiducial correction system
  • Multiple level password protection
  • Light stack
  • Flux level sensor
  • PillarCOMM Windows® based ‘Point & Click’ interface
  • Lead-free compatible
  • Day-to-day service kit
specifications
Height
1390mm / 55” to 2045mm / 80½”- with light stack
Width
2193mm / 86½“ Compact 2930mm / 115½” Standard
Depth
1520mm / 60” 1740mmm / 68½” with flux bottles
Board size
381mm x 460mm / 15”x 18” (Standard frame with 4 stations) Larger PCB size available upon request
Edge clearance
Above / below 3mm
Height clearance
Above / below 40mm nominal, 70mm max.
Solder
Most commonly used solder types – including lead-free
Solder pot capacity
20kg standard – 30kg large bath
Applicators
AP style – 2.5 – 16mm dia. Extended and Jet-Tip nozzles – up to 25mm dia. Jet-Wave nozzles – up to 25mm width Special dedicated nozzles available upon request
Flux
Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
X, Y & Z Axis resolution
0.15mm
Repeatability
+/- 0.05mm
Nitrogen usage
40 litres gas/min per bath using single bath with standard AP solder nozzle, 5 bar / 72 psi pressure.
Nitrogen purity
99.995% or better
Air supply pressure
5 bar / 72 psi
Power supplies
Three-phase + neutral + PE
Voltage
230 V phase to neutral / 400V phase to phase
Frequency
50/60Hz
Power
Machine configuration dependent – contact your local Pillarhouse representative
Transport
Motorised conveyor
Programming
PillarCOMM Windows® based ‘Point & Click’ interface
Promotion Movie