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    The Orissa Fusion is available in two frame sizes.

    Fusion Compact

    The standard three station cell can be configured to handle PCB’s up to 381mm x 430mm (fluxer, pre-heat and solder).   Alternatively, this system can be supplied as a two station unit each with increased PCB handling capacity up to 746mm x 430mm.

    Fusion Standard

    The standard four station cell can be configured to handle PCB’s up to 430mm x 381mm (fluxer, pre-heat, solder, solder).  For high speed applications this same unit can be configured as fluxer/pre-heat and up to three solder modules with as many as five heater options. Maximum PCB handling size in Y Axis of up to 500mm with limited auto-fiducial and PCB warp correction function up to 430mm.

    Each solder cell can be configured with any of the currently available Pillarhouse solder technologies: custom-dip, multi-dip, Jet-Wave and single point AP down to the patented 1.5mm micro nozzle.

    Easy, rapid non-contact solder pot changeover is facilitated via the optional heated pot exchange trolley.

  • Integral PC and machine mounted Titanium monitor
  • In-line motor driven width adjust through feed conveyor
  • Conveyor side clamping
  • DC servo drives with encoders on X, Y & Z axis
  • Inerted Nitrogen system
  • Internal fume extraction
  • Titanium Drop-Jet fluxer
  • Motorised wire feed auto solder top-up & solder level detect
  • Solder wave height measurement and correction system
  • Solder bath coding – identifies correct bath for program
  • Thermal nozzle calibration system using integrated setting camera
  • Auto-nozzle conditioning system
  • Pump rpm
  • Set of AP solder nozzle tips
  • Colour programming camera
  • Process viewing camera
  • Automatic fiducial correction system
  • Multiple level password protection
  • Light stack
  • Flux level sensor
  • PillarCOMM Windows® based ‘Point & Click’ interface
  • Lead-free compatible
  • Day-to-day service kit
1390mm / 55” to 2045mm / 80½”- with light stack
2193mm / 86½“ Compact 2930mm / 115½” Standard
1520mm / 60” 1740mmm / 68½” with flux bottles
Board size
381mm x 460mm / 15”x 18” (Standard frame with 4 stations) Larger PCB size available upon request
Edge clearance
Above / below 3mm
Height clearance
Above / below 40mm nominal, 70mm max.
Most commonly used solder types – including lead-free
Solder pot capacity
20kg standard – 30kg large bath
AP style – 2.5 – 16mm dia. Extended and Jet-Tip nozzles – up to 25mm dia. Jet-Wave nozzles – up to 25mm width Special dedicated nozzles available upon request
Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
X, Y & Z Axis resolution
+/- 0.05mm
Nitrogen usage
40 litres gas/min per bath using single bath with standard AP solder nozzle, 5 bar / 72 psi pressure.
Nitrogen purity
99.995% or better
Air supply pressure
5 bar / 72 psi
Power supplies
Three-phase + neutral + PE
230 V phase to neutral / 400V phase to phase
Machine configuration dependent – contact your local Pillarhouse representative
Motorised conveyor
PillarCOMM Windows® based ‘Point & Click’ interface
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