Trans Technology – SMT Electronics Solutions Singapore

ORISSA FUSION

PRODUCT DESCRIPTION

The Orissa Fusion is available in two frame sizes.

Fusion Compact

The standard three station cell can be configured to handle PCB’s up to 381mm x 430mm (fluxer, pre-heat and solder). Alternatively, this system can be supplied as a two station unit each with increased PCB handling capacity up to 746mm x 430mm.

Fusion Standard

The standard four station cell can be configured to handle PCB’s up to 430mm x 381mm (fluxer, pre-heat, solder, solder). For high speed applications this same unit can be configured as fluxer/pre-heat and up to three solder modules with as many as five heater options. Maximum PCB handling size in Y Axis of up to 500mm with limited auto-fiducial and PCB warp correction function up to 430mm.

Each solder cell can be configured with any of the currently available Pillarhouse solder technologies: custom-dip, multi-dip, Jet-Wave and single point AP down to the patented 1.5mm micro nozzle.

Easy, rapid non-contact solder pot changeover is facilitated via the optional heated pot exchange trolley.

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features

Integral PC and machine mounted Titanium monitor
In-line motor driven width adjust through feed conveyor
Conveyor side clamping
DC servo drives with encoders on X, Y & Z axis
Inerted Nitrogen system
Internal fume extraction
Titanium Drop-Jet fluxer
Motorised wire feed auto solder top-up & solder level detect
Solder wave height measurement and correction system
Solder bath coding – identifies correct bath for program
Thermal nozzle calibration system using integrated setting camera
Auto-nozzle conditioning system
Pump rpm
Set of AP solder nozzle tips
Colour programming camera
Process viewing camera
Automatic fiducial correction system
Multiple level password protection
Light stack
Flux level sensor
PillarCOMM Windows® based ‘Point & Click’ interface
Lead-free compatible
Day-to-day service kit

specifications

Height

1390mm / 55” to 2045mm / 80½”- with light stack

Width

2193mm / 86½“ Compact 2930mm / 115½” Standard

Depth

1520mm / 60” 1740mmm / 68½” with flux bottles

Board size

381mm x 460mm / 15”x 18” (Standard frame with 4 stations) Larger PCB size available upon request

Edge clearance

Above / below 3mm

Height clearance

Above / below 40mm nominal, 70mm max.

Solder

Most commonly used solder types – including lead-free

Solder pot capacity

20kg standard – 30kg large bath

Applicators

AP style – 2.5 – 16mm dia. Extended and Jet-Tip nozzles – up to 25mm dia. Jet-Wave nozzles – up to 25mm width Special dedicated nozzles available upon request

Flux

Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available

X, Y & Z Axis resolution

0.15mm

Repeatability

+/- 0.05mm

Nitrogen usage

40 litres gas/min per bath using single bath with standard AP solder nozzle, 5 bar / 72 psi pressure.

Nitrogen purity

99.995% or better

Air supply pressure

5 bar / 72 psi