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JADE MK IV
PRODUCT DESCRIPTION

    As part of the entry-level philosophy for this system, a low maintenance solder bath and pump mechanism has been developed which moves in three axes of movement whilst not limiting access to the PCB. Solder is applied using proven technology through our AP nozzle design or custom specialised nozzles, incorporating patented spiral solder return to bath technology offering reduced solder balling potential.

    As with all Pillarhouse systems, the soldering process is enhanced by a hot Nitrogen curtain which provides an inert atmosphere. This method of soldering also assists in the prevention of oxidisation and provides a local preheat to the joint, thus reducing thermal shock to localised components.

    The Jade MK IV is controlled by a PC, through Enhanced PillarCOMM, a Windows® based ‘Point & Click’ interface with PCB image display.
    Additionally, our PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.

features
  • 508x610mm (20×24″) board size
  • Integral PC and machine mounted TFT monitor
  • Inerted Nitrogen system
  • Motorised auto-solder top-up (wire feed) & solder level detect
  • Titanium Drop-Jet fluxer
  • Set of AP style solder nozzle tips
  • Internal fume extraction
  • Colour programming camera
  • Process viewing camera
  • Manual fiducial correction
  • Auto-nozzle conditioning system
  • Solder wave height measurement and correction
  • New Solder bath and pump design
  • Pump rpm monitoring
  • Universally adjustable tooling carrier
  • Thermal nozzle calibration system using integrated setting camera (requires manual correction)
  • Enhanced PillarCOMM Windows® based ‘Point & Click’ interface
  • PillarPAD offline programming package
  • Multiple level password protection
  • Lead-free compatible
  • Day-to-day service kit
specifications
Height
1129mm / 45” – excluding light stack and optional viewing monitor
Width
1110mm / 44“
Depth
1840mm / 73”
Board size
508mm x 610mm / 20”x24″
Edge clearance
Above / below 3mm
Height clearance
Above / below 40mm nominal
Solder
Most commonly used solder types – including lead-free
Solder pot capacity
10kg
Applicators
AP style – 2.5mm to 16mm dia. Extended AP style – 2.5mm to 20mm dia. Micro nozzle – 1.5mm to 2.5mm Jet-Tip style – 6mm to 20mm dia. Jet-Wave nozzle – up to 25mm width Special dedicated nozzles available upon request
Flux
Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water soluble system available
X, Y & Z Axis resolution
0.1mm
Repeatability
+/- 0.05mm
Nitrogen usage
35 litres gas/min. 5 bar pressure
Nitrogen purity
99.995% or better
Air supply pressure
5 bar / 72 psi
Power supplies
Single phase + PE
Voltage
208V-250V
Frequency
50/60Hz
Power
4kVA
Power with IR preheat
6.5kVA – Top side 8kVA – Top and bottom side
Transport
Hand load
Tooling
Integral adjustable board guides, includes finger extensions and board clamps
Programming
Enhanced PillarCOMM Windows® based ‘Point & Click’ interface