Trans Technology – SMT Electronics Solutions Singapore

ORISSA SYNCHRODEX PRO

PRODUCT DESCRIPTION

Supplied as standard with our patented design Drop-Jet fluxer, this system offers accurate, controlled flux deposition either prior to or during the optional top side preheat function. Preheat can be controlled via an optional top-side closed loop pyrometer system for optimum temperature profile regulation.

Our low maintenance solder bath and pump mechanism moves in three axes. Solder is applied using our proven technology single point AP nozzle design incorporating patented spiral solder return to bath technology offering increased wave stability with reduced potential for solder balls.

The system can also accommodate our latest generation micro nozzle, together with Jet-Wave, Wide-Wave and dedicated multi-tube single dip solder technology.

As with all Pillarhouse systems, the soldering process is enhanced by a hot Nitrogen curtain which provides an inert atmosphere for the soldering process and also assists in the prevention of oxidation. This process provides a local preheat to the joint thus reducing thermal shock to localised components.

The Synchrodex Pro is controlled by a PC, through new generation PillarCOMM, a Windows^® based ‘Point & Click’ interface with PCB image display. Additionally, our optional PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.

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features

Up to 1140mm x 610mm (45” x 24”) board handling with 610mm x 610mm (24″ x 24″) as standard
Interchangeable Mechanical or Magnetic solder bath and pump
Lead-free solder capability
Inerted Nitrogen system
Set of AP style solder nozzle tips
Automatic nozzle conditioning system
Thermal nozzle calibration
Solder level detect and motorised wire feeder
Wave height correction
DC drives on all axes
Colour programming camera
Automatic fiducial correction
Drop Jet fluxer
Internal fume extraction
Integral PC and monitor
New PillarCOMM control software
Multiple level password protection
IPC-2591 (CFX), Smart Factory ready

specifications

Height

1391mm / 55” – excluding light stack

Width

958mm / 38“

Depth

2010mm / 79”

Board size

Max. – 1140mm x 610mm (45” x 24”) or 610mm x 610mm (24″ x 24″) Min. – 102mm x 102mm / 4”x 4”

Edge clearance

Above/below 3mm

Height clearance

Below 40mm – above 45mm 100mm – upon request

Solder

Most commonly used solder types – including lead-free

Solder pot capacity

20kg standard

Applicators

AP style – 2.5 – 16mm dia. Extended and Jet-Tip nozzles – up to 25mm dia. Jet-Wave nozzles – up to 25mm width 75mm and 150mm Wave nozzle

Flux

Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available

Flux tank capacity

1 litre

Fluxer speed

50 dots/second

Deposition size

4.0-6.0mm / 0.16-0.24”

X, Y & Z axis resolution

0.15mm

Repeatability

+/- 0.05mm

Nitrogen supply pressure:

5 bar / 72 psi

Nitrogen usage

30-100 litres/min. – solder nozzle configuration dependent

Nitrogen purity

99.995% or better

Air supply pressure

5 bar / 72 psi

Air usage

10 litres/min. / 0.35 CFM

Power supplies

Three-phase + neutral + PE

Voltage

230 V phase to neutral / 400V phase to phase

Frequency

50/60Hz

Power

Machine configuration dependent – contact your local Pillarhouse representative

Transport

Conveyor