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PRODUCT DESCRIPTION
    • “1-head solution” to perform various inspections with a single head
    • Achieves high-accuracy high-speed inspections using 3D+2D inspection, image resolution switch-over and more
    • A thorough and extensive machine-to-machine (M2M) solution
    • Statistical Process Control (SPC) for diverse statistical processing
    • Optional features to enable handling various products
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features
  • “1-head solution” to perform various inspections with a single head
  • Accurate inspections by unique measurement algorithm combining 2D and 3D
  • Extensive machine-to-machine (M2M) solution
  • Statistical Process Control (SPC) for diverse statistical processing
specifications
Applicable PCB
L510×W460mm~L50×W50mm (single lane spec) *No dual lane specification available.
Horizontal resolution (FOV size)
1)25µm / 12.5µm (approx. 50×50mm) 2)20µm / 10µm (approx. 40×40mm) 3)15µm / 7.5µm (approx. 30×30mm) *All are standard selection type.
Height resolution
1µm
Inspection items
Solder paste printing quality (volume, height, area and misalignment)
Power supply
Single-phase AC 200V–230V ±10%
Air supply source
Airless specification
External dimension
L904×W1,080×H1,478 mm
Weight
Approx. 550 kg
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