Trans Technology – SMT Electronics Solutions Singapore

PILOT

PRODUCT DESCRIPTION

Although a low-cost system, the PILOT is offered with the ability to run the acclaimed highly flexible Pillarhouse AP nozzle technology, together with our patented market leading 1.5mm micro nozzle. The process is enhanced by a localised hot Nitrogen environment at the point of soldering. An optional Nitrogen generator is built into the base of the unit and can be used to supply Nitrogen at the required levels, whilst acting as a machine stand.

Designed for low maintenance, the PILOT offers a slide in/out solder bath design for ease of access. This in conjunction with our proven impellor driven pump technology, makes a highly reliable low maintenance system.

By carrying product over the flux, solder and optional preheat stations, the PILOT offers a light, highly accurate X, Y system.

Programming is accessed through the world leading Pillarhouse ‘Point and Click’ PillarCOMM software package. Optional offline programming is available via PillarPAD which allows programs to be generated independently from the machine using Gerber data.

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features

Machine mounted TFT monitor with integral PC
Inerted Nitrogen system
Titanium Drop-Jet fluxer
One AP style solder nozzle tip
Internal fume extraction
Manual Fiducial Correction System
Process Viewing Camera
Colour programming camera
Two universally adjustable tooling carriers
PillarPAD offline programming system
PillarCOMM LITE – Windows® based ‘Point & Click’ interface
Solder wave height measurement & correction
Lead-free compatible
Day-to-day service kit

specifications

Height

With monitor 1050mm / 42”, with cowling 750mm / 29” – without 695mm / 27”

Width

With flux bottles 1090mm / 43”- without 915mm / 36” with solder bath out 1380mm / 54”

Depth

700mm / 28” to 963mm / 38” with keypad tray out

Weight

170kg (table-top format)

Board size

330mm x 250mm / 13″ x 10″

Edge clearance

Above / below 3mm

Height clearance

Above / below 40mm nominal

Solder

Most commonly used solder types – including lead-free

Solder pot capacity

6kg

Applicators

AP style – 2.5mm to 16mm dia. Extended AP style – 2.5mm to 20mm dia. Micro nozzle – 1.5mm to 2.5mm Jet-Tip style – 6mm to 20mm dia. Special dedicated nozzles available upon request

Flux

Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available

X, Y & Z Axis resolution

0.1mm

Repeatability

+/- 0.05mm

Nitrogen usage

30 litres gas/min. 5 bar pressure

Nitrogen purity

99.99% or better

Power supplies

Single phase + PE