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1809 MK5 - Heller Advanced In-Line Voidless / Vacuum Reflow Soldering Oven
PRODUCT DESCRIPTION
Voidless / Vacuum Reflow Soldering Oven Nitrogen System with Balanced Flow Technology
features
- 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry!
- 100" Heated Length - for super reflow soldering throughput!
- 2 Internal Cooling Zones - gives lowest exit temperature!
- 180" Total Length - optimizes floorspace utilization!
- NEW Module Design with 10" modules gives the flexibility to subdivide the profile into smaller segments and allows for more refined "profile sculpting". The only way to satisfy demanding Lead Free Applications!
- Reflow zones configured for Lead Free Soldering as well as Eutectic requirements.
- Nitrogen Inert Atmosphere To 10 PPM with 50% reduction in N2 consumption !
- AWARD WINNING Flux Separation System
- Oxygen Monitoring With Closed Loop Control for tightest process control!
- Oven Cpk Reporting Software - Powered by ECD, this SPC package gives real time Cpk info on your process - A STANDARD FEATURE at No additional charge!
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